Industrial applications of glass and ceramic materials have increased manifold due to their relatively low friction, high compression strength, high temperature and wear resistance, and excellent chemical inertness, etc. In micro-electromechanical systems (MEMS) the use of glass, along with silicon and polymer, has become very popular. However, micro-fabrication of glass is a difficult process. The electrochemical discharge machining (ECDM) is now often used as one of the chip less machining solutions for these materials. The ECDM, however, is a complex process with multiple controllable parameters and exhibits stochastic nature. The mechanism of material removal in the process is yet to be understood well in spite of many theories. In this thesis, an attempt has been made to model and simulate thermal damage while machining through Electro chemical discharge machining (ECDM).